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C110 (Cu-ETP)

Electrolytic tough pitch (ETP) copper

220–275 MPaTensile strength
70–145 MPaYield
40–90 HBHardness
8.96 g/cm³Density
120 GPaModulus E
20%Machinability

Typical values for the temper in the title

C110 (Cu-ETP) is the most common copper: at least 99.90% copper, with about 200–400 ppm oxygen as copper oxide. Its electrical and thermal conductivity are very high (about 100% IACS), and it is ductile, formable and easy to solder.

It is the basic material for busbars, cables and conductors, heat exchangers and roofing. Its main limitation is the oxygen: heated in a hydrogen atmosphere, it embrittles.

Mechanical and physical properties

PropertyValueNote
Tensile strength Rm220–275 MPa
Yield strength Rp0.270–145 MPa
Elongation A25–50%
Hardness40–90 HB
Modulus of elasticity E120 GPa
Density ρ8.96 g/cm³
Electrical conductivityabout 100% IACS (annealed)per MWS data
Machinability20%relative rating in the site database

Chemical composition (wt %)

ElementRangeRole
Cu copper (incl. Ag)min 99.90conductivity
O oxygenabout 0.02–0.04 (200–400 ppm)as Cu2O

Per ASTM B124 and copper.org data.

Tempers and heat treatment

Ordinary copper and brass are not hardened by heat treatment. Strength comes from cold work, marked as the temper: annealed (O) is soft, up to "hard" (H) is strong. Annealing returns the material to the soft condition.

ConditionPropertiesWhen to choose it
Annealed (O)soft and ductile, lowest strength in the rangedeep drawing and bending
Half hard (H02)medium strengthgeneral parts
Hard (H04 and up)high strength, low ductilitysprings and contacts

Applications

Fabrication

Hydrogen embrittlement

Heated above about 400 °C in a hydrogen-bearing atmosphere, hydrogen reacts with the oxide to form steam at the grain boundaries, and the material cracks. For brazing or annealing in hydrogen, use oxygen-free copper (C101 or C102).

Machining

Difficult: pure copper is soft and "gummy". Sharp tools with a large positive rake.

Joining

Soldered and brazed easily. In welding, the high thermal conductivity requires preheat.

Compared with similar materials

MaterialRm / Rp0.2WeldingWhen it is the better choice
C101 (Cu-OFE)220 / 70 MPaGood (TIG)oxygen-free, for hydrogen brazing and vacuum · material page
GlidCop AL-15440 / 400 MPaElectron beamstrengthened copper, keeps strength after heat · material page
C17200 (CuBe2)1380 / 1190 MPaElectron beam / laserstrong beryllium copper, low conductivity · material page

Common mistakes

Brazing C110 in a hydrogen furnace

The material embrittles and cracks. Use oxygen-free copper.

Machining with dull tools

The material smears, damaging finish and dimensions.

Ordering just "copper" without a grade

ETP, OF and DHP differ in hot behavior and conductivity.

Equivalents, standards and supply

ENCW004A
DINE-Cu58
JISC1100
StandardsASTM B152 / EN 1652 / ISO 197
Formsplate · strip · wire · rod
ProducersAurubis · Wieland · Mitsubishi Materials

Learn more

Values are typical and for comparison only. For design, rely on the standard and the mill certificate. Sources: Copper Development Association (copper.org), ASTM B111 and B124, producer data sheets, and the METAL HUB materials database.
Updated: October 31, 2026